VCSEL wet oxidation furnace
Product Overview
A wet oxidation process developed specifically for VCSEL devices, creating a dense optical confinement layer and electrical insulation structure; simultaneously compatible with general wafer surface passivation treatment, meeting the dual process requirements of optoelectronic and semiconductor devices.
Product Features
Precise Temperature and Humidity Control: Achieves precise humidity adjustment in medium and low temperature environments, ensuring a dense oxide layer structure for VCSEL devices.
High Yield Process Guarantee: Enhances device electrical insulation and optical field confinement through stable temperature control and process design.
High Reliability System Design: Stable equipment operation meets the precision process requirements of optoelectronic device preparation.
Technical Specifications
Wafer Size: 6 inches
Temperature Range: 300°C-500°C
Constant Temperature Zone Length: 250mm
Loading Quantity: 25 pieces/batch
Application Scenarios
Applicable Materials: 6-inch and smaller wafers (such as gallium arsenide).
Applicable Processes: Medium and low temperature wet oxidation process (300℃-500℃), used for VCSEL device oxide layer preparation.
Applicable Fields: Optoelectronic device (such as vertical cavity surface emitting laser) manufacturing.
Product Category
Industrial version
Keyword
EXWELL
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Address: No. 858, Purui West Road, Wangcheng Economic and Technological Development Zone, Changsha City
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