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Provide a full process equipment solution from device research and development to mass production
Industrial version
Research version
Tubular thermal equipment vertical furnace
Batch vertical structure heat treatment equipment, suitable for high-temperature processes of wafers 8 inches and below. It can perform key processes such as diffusion, oxidation, and annealing, and is specially designed to provide a flexible process verification platform for research institutions.
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Tubular thermal equipment horizontal furnace
Small-batch, high-precision equipment designed for research institutions and universities. Supports oxidation, diffusion, annealing, LPCVD and other processes, and combines production, experimental teaching, and process development functions.
PVD magnetron sputtering coating machine
The physical vapor deposition (PVD) method is employed to deposit various films of metals, alloys, oxides, nitrides, etc. on the substrate surface. The deposition efficiency and the quality of the film have been improved. Fast deposition rate, low deposition temperature, good film adhesion, high density and good uniformity.
Dry etching, Reactive Ion Etching (RIE)
Dry etching equipment based on radio frequency discharge principle, which achieves material removal through a combination of physical bombardment and chemical reaction, suitable for etching various semiconductor materials.
Dry etching ion beam etching (IBE)
Using ion beam physical etching technology, suitable for high-precision processing of difficult-to-etch materials, especially with unique advantages in the processing of hard and brittle materials such as metals and ceramics.