Tubular thermal equipment vertical furnace
Product Overview
Batch-type vertical structure heat treatment equipment, suitable for high-temperature processes of 8-inch and smaller wafers. It can perform key processes such as diffusion, oxidation, and annealing, and is specially designed to provide a flexible process verification platform for research institutions.
Product Features
High-Precision Temperature Control System: Achieves precise temperature control for oxidation/annealing processes, ensuring process repeatability in the research phase.
High Yield Rate Design: Adapts to the needs of small-batch experiments in research, reducing trial-and-error costs.
High Reliability and Stability: Supports long-term continuous operation to meet the needs of long-term research experiments.
Technical Specifications
Wafer Size, Number of Process Tubes8-inch and below 1-4 tubes (Optional)/unit |
Temperature Range200°C-600°C 600°C-1200°C |
Temperature Uniformity≤±1°C (<800°C) ≤±0.5°C (>800°C) |
Constant Temperature Zone Length200~300 mm |
Single-Point Temperature Stability≤ ±0.5°C/24h (1100°C) |
Temperature Ramp Rate CapabilityMaximum Heating Rate 15°C/min |
Application Scenarios
Applicable Materials: Silicon, compound semiconductors, etc.;
Core Processes: Dry oxidation, wet oxidation, inert gas annealing;
Application Fields: Semiconductor device isolation layer preparation, surface passivation layer process, VCSEL chip manufacturing.
Product Category
Research version
Keyword
EXWELL
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