Low-temperature oxidation/annealing furnace
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  • Low-temperature oxidation/annealing furnace

Low-temperature oxidation/annealing furnace



Product Overview

Under low-temperature conditions, precise heat treatment is carried out to eliminate lattice defects and metal impurities at the wafer interface, or to form an oxide layer that serves as insulation, protection, and dielectric isolation. To optimize the electrical properties of materials, significantly improve device reliability and mass production yield.

 

Product Features

High precision humidity (oxidation) temperature control: using a professional temperature control system to accurately regulate the medium and low temperature range, effectively eliminating interface defects on silicon wafers, and ensuring the uniformity and stability of the process.

High yield process guarantee: By stable temperature control and process design, the electrical insulation and light field limiting effect of the device are improved.

Advanced particle pollution prevention and control: Combined with efficient purification technology, reducing particle interference during the process and ensuring the quality of silicon wafer interfaces.

High reliability system design: The equipment operates stably and meets the precision process requirements for the preparation of optoelectronic devices.

Large scale production capacity design: Outstanding single batch processing capability, suitable for the efficiency requirements of scientific research and mass production.

 

Technical Specifications

Wafer size: 8 inches (compatible with 6 inches)

Temperature range: 250 ° C-500 ° C

Constant temperature zone length: 860mm

Loading capacity: 150 pieces/batch

Applicable materials: lithium niobate, silicon, etc

 

Application Scenarios

Applicable materials: semiconductor substrates such as silicon, lithium niobate, aluminum oxide, etc.

Applicable process: Low temperature oxidation/annealing process (250 ℃ -500 ℃), used to eliminate lattice defects, optimize interface quality, or prepare high-quality oxide layers.

Applicable fields: integrated circuits, optoelectronic devices MEMS。

Product Category

Industrial version

Keyword

EXWELL

Low-temperature oxidation/annealing furnace
+
  • Low-temperature oxidation/annealing furnace