Magnetron sputtering coating machine (multi-chamber)
Product Overview
Achieves fully automated thin film deposition through a multi-chamber cluster architecture, meeting the high-consistency mass production needs of metal electrodes, optical coatings, and electromagnetic shielding layers.
Product Features
Modular design of independent process chambers: Supports combinations of multiple process module types, enabling fully automated coating.
High target material utilization and low energy consumption: Optimized sputtering process, reducing production costs while increasing production capacity.
High-stability thin film deposition: Ensures the density and adhesion of metal and dielectric films, meeting high-functionality requirements.
Technical Specifications
Applicable wafer size: 8-inch, 6-inch
Number of process chambers: ≤5
Process chamber type: Sputtering, pre-cleaning/etching
Ultimate vacuum: 1X10 -5 Pa
Uniformity: ≤±0.5%
Applicable materials: Silicon, compounds, etc.
Application Scenarios
Applicable materials: 8-inch and smaller wafers, compound semiconductors.
Applicable processes: Multi-chamber magnetron sputtering, used for fully automated deposition of metal and dielectric films.
Applicable fields: Large-scale integrated circuit manufacturing, advanced thin-film device fabrication.
Product Category
Industrial version
Keyword
EXWELL
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+86 0731-88376310
Address: No. 858, Purui West Road, Wangcheng Economic and Technological Development Zone, Changsha City
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