PVD magnetron sputtering coating machine
Product Overview
A multifunctional coating equipment based on Physical Vapor Deposition (PVD) technology, capable of depositing various thin films such as metals, dielectrics, and semiconductors, supporting single-layer/multilayer composite structures.
Product Features
Excellent Step Coverage Ability: Highly adaptable to complex three-dimensional surface coating, ensuring uniform film formation on irregular structures such as deep holes and high steps.
Multi-material Process Compatibility: Supports the preparation of thin films of metals such as Al, Au, Cu, and dielectrics such as SiO₂, TaN, adapting to diverse process needs.
Flexible Configuration Options: Provides modular configurations such as multi-target sputtering, pre-vacuum chamber, sample cleaning, and multi-wafer cassette to meet individual process requirements.
Technical Specifications
Wafer Size8 inches and below |
Substrate Stage Temperature ControlRT-600℃ (Heating or Cooling) |
Substrate Stage Rotation Speed5-20 rpm |
Sputtering MethodSingle-target Sputtering Sequential multi-target Sputtering or Simultaneous Sputtering |
Power Supply ConfigurationOptional DC/RF/MF etc. |
Uniformity4-inch target, 8-inch wafer: +3% (MAX-MIN)2*AVG |
Application Scenarios
Applicable Materials: Silicon, ceramics, quartz glass, compound semiconductors, etc.;
Core Processes: Metal interconnect layer deposition, optical film preparation, barrier layer process;
Application Fields : Semiconductor packaging, optoelectronic device manufacturing, new energy thin film preparation.
Product Category
Research version
Keyword
EXWELL
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Service hotline:
+86 0731-88376310
Address: No. 858, Purui West Road, Wangcheng Economic and Technological Development Zone, Changsha City
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