Dry etching, Reactive Ion Etching (RIE)
Product Overview
Dry etching equipment based on radio frequency discharge principle, achieving material removal through a combination of physical bombardment and chemical reaction, suitable for etching various semiconductor materials.
Product Features
Digital Intelligent Control: Fully digital automatic control of the process, easy to operate and learn.
Constant Pressure Automatic Control: Automatic adjustment of constant reaction pressure to ensure process repeatability and stability.
Configurable load lock loading chamber: Reduces air pollution and improves loading efficiency and chamber vacuum retention.
Technical Specifications
Wafer Size8 inches and below |
Etch Rate0.1-4um/min (depending on the specific material and process) |
Uniformity+5% (MAX-MIN)2*AVG |
Substrate Stage CoolingWater Cooling |
Application Scenarios
Applicable Materials: Silicon, silicon dioxide, silicon nitride, etc.;
Core Processes: Transistor gate etching, MEMS structural processing, contact hole etching;
Application Fields: Integrated circuit manufacturing, microelectromechanical systems, optoelectronic devices.
Product Category
Research version
Keyword
EXWELL
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Address: No. 858, Purui West Road, Wangcheng Economic and Technological Development Zone, Changsha City
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