Magnetron sputtering coating machine
Product Overview
Employing advanced PVD technology, we precisely meet process requirements by rigorously controlling film thickness and uniformity to achieve highly dense, strongly bonded, ultra‑high‑purity functional films.
Product Features
High-precision temperature control capability: The substrate stage’s temperature control accommodates the varying temperature requirements of thin-film deposition for different materials.
Advanced Particle Pollution Control: The cavity design minimizes particle contamination during the coating process, enhancing the purity of the thin film.
High Production Capacity and Automated Integration: Suitable for mass production, supporting the fabrication of thin films on a variety of materials, including metals and dielectrics.
Technical indicators
Cavity composition: LOADLOCK chamber + process chamber (optional multi-wafer cassette system)
Applicable wafer size: 8 inches and below
Number of target guns: ≤4 pieces
Substrate stage temperature control: RT-650 (or cooling)
Ultimate vacuum: 8X10 -5 Pa
Uniformity: ≤±3%
Applicable materials: Silicon, compounds, ceramics, etc.
Application scenarios
Applicable materials: Silicon, compound semiconductors, ceramics, quartz, and other substrates.
Applicable Process : Magnetron sputtering coating, used to fabricate thin films of metals (such as Al, Au) and dielectrics (such as SiO₂, ITO).
Applicable fields: Fabrication of integrated circuit electrodes and thin-film deposition for optoelectronic devices.
Product Category
Industrial version
Keyword
EXWELL
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Service hotline:
+86 0731-88376310
Address: No. 858, Purui West Road, Wangcheng Economic and Technological Development Zone, Changsha City
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