Magnetron sputtering coating machine
Product Overview
Utilizing advanced PVD technology and strictly controlling film thickness and uniformity, it efficiently deposits high-density, strong-bonding, ultra-high-purity functional films to precisely meet process requirements.
Product Features
High-Precision Temperature Control Capability: The substrate temperature control adapts to the temperature requirements of different material film depositions.
Advanced Particle Contamination Control: The chamber design reduces particle interference during the coating process, improving film purity.
High Throughput and Automated Integration: Suitable for mass production, supporting the preparation of various material films such as metals and dielectrics.
Technical Specifications
Chamber Composition: LOADLOCK chamber + process chamber (optional multi-wafer cassette system)
Applicable Wafer Size: 8 inches and below
Number of Targets: ≤4
Substrate Temperature Control: RT-650 (or cooling)
Ultimate Vacuum: 8X10 -5 Pa
Uniformity: ≤±5%
Applicable Materials: Silicon, compounds, ceramics, etc.
Application Scenarios
Applicable Materials: Silicon, compound semiconductors, ceramics, quartz, and other substrates.
Applicable Processes Magnetron sputtering coating, used for preparing metal (such as Al, Au) and dielectric (such as SiO₂, ITO) films.
Applicable Fields: Integrated circuit electrode preparation, optoelectronic device film deposition.
Product Category
Industrial version
Keyword
EXWELL
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+86 0731-88376310
Address: No. 858, Purui West Road, Wangcheng Economic and Technological Development Zone, Changsha City
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