Products and Solutions

Provide a full process equipment solution from device research and development to mass production

Industrial version

Research version

Horizontal oxidation diffusion annealing furnace

Integrates oxidation, diffusion, and annealing functionalities. Supports doping control, interface optimization, and structure formation of silicon-based and wide-bandgap semiconductor materials, serving the core processes of wafer mass production.

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Horizontal LPCVD

Solid thin films such as silicon nitride and doped polysilicon are produced on the substrate surface through low-pressure chemical vapor deposition, meeting the high-volume deposition requirements for device dielectric encapsulation and passivation layers.

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Magnetron sputtering coating machine

Employing advanced PVD technology and through strict control of film thickness and uniformity, we efficiently deposit high-density, strongly bonded, ultra-high-purity functional films to precisely meet process requirements.

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Magnetron sputtering coating machine (multi-chamber)

Achieve fully automated thin-film deposition through a multi-chamber cluster architecture to meet the high-consistency mass production needs of metal electrodes, optical coatings, and electromagnetic shielding layers.

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Low-temperature oxidation/annealing furnace

Precise heat treatment carried out under inert gas protection eliminates lattice defects at the wafer interface, optimizes the electrical properties of materials, and significantly enhances device reliability and mass production yield.

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Packaging equipment Laser sealing machine

Non-contact laser welding technology enables high hermeticity packaging of devices under vacuum or inert atmosphere, meeting military-grade reliability requirements.

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Service hotline:

+86 0731-88376310

Address: No. 858, Purui West Road, Wangcheng Economic and Technological Development Zone, Changsha City

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